Rucker Kolls, Inc. Innovative Solutions for ATE Test Interface Products

Cantilever | Multi-site | Butterfly | Blades | Low Leakage | Custom PCB Design | Card Stiffeners/Rings | Specs. | Equip. | Spares

Using Cantilever technology with small to high pin count shipping probe cards in excess of 1500 probes per device, Rucker Kolls provides the options of multi-site, high temperature, bump, tight pad pitch, low leakage, and RF applications.

  • Cost-effective probing solutions
  • Optimized for long term use
  • Low to High pin count
  • Pad Pitch in line- 45 micron; staggered 35/70 microns
  • High temperature applications available
  • Bump/Array Probing
  • Applied Precision Probe Card Analyzer
  • Equipped Quality Assurance department

 

 

 

PROBE CARD SPECIFICATIONS

Minimum Pad Pitch: 45um in-line, 35/70um staggered

Minimum Bond Bad: <45um square

Electrical Specifications Measured on Probe Card Analyzer

  • Planarity and Alignment: +/-0.25 mils for flat pads
  • Contact Resistance Measured: <2 ohms at 25mA
  • Standard Leakage 10nA @ 5V

Probe Tip Depth: Probe depth is measured from probe tip to the bottom of the PCB 80-350 mils +/-5 mils. (This is dependent on temperature and probe layer count)

Balance Contact Force (BCF): 1.2 to 3.0 gm/mil of overdrive (Dependent on overall design of ring, pad pitch and pad size)

Tip Diameter: +/-.2 mils

Tip Length: +2/-1 mil

Edge Sensor: 2 wire, 2 wire isolated, 3 wire isolated

Edge Sensor Resistance: 1.0Ω max between the sensor probe and the switch

Probing Temperature: Ambient up to 150º C, High Temp 151°- 200º C

Probe Material:

  • Tungsten
  • Rhenium Tungsten (RhTungsten)
  • Hardened Beryllium Copper (HBeCu)
  • Beryllium Copper (BeCu)
  • Paliney7™
  • Newtek

Printed Circuit Boards Materials:

  • High Temp FR4 (Polyclad 370)
  • Gtek
  • Nelco High Performance (N4000-13)
  • Polyimide
  • Rogers™
  • Mixed Dielectrics
  • Flatness 5.0 mils per linear inch

PCB Design and Fabrication

BCF measurements available upon request

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