Rucker Kolls, Inc. Innovative Solutions for ATE Test Interface Products

Cantilever | Multi-site | Butterfly | Blades | Low Leakage | Custom PCB Design | Card Stiffeners/Rings | Specs. | Equip. | Spares

Shelf Technology

Shelf Technology saves our customers both money and time through our optimum multi-site configuration allowing more die to be tested in a shorter time with a reduction in touchdowns.

  • Multi-site configuration
  • Uniform beam length optimizes control of balance contact force (BCF)
  • Minimum to no probe fan-out
  • Consistent small Inline probe scrub reduces yield loss
  • Option of 1x2, 2x2, 2x3, 2x4, etc. for more efficient probe mapping


Innovation and experience in probe card assembly runs deep at Rucker Kolls. Not only does the Butterfly™ design provide a cost-effective solution for multi-DUT applications, but it has solved several problems inherent in Shelf- type probe cards.

  • Achieves higher yield with minimum expense
  • No need to change existing test equipment
  • Fewer probe tiers for better alignment and planarity
  • All scrub marks travel in same direction
  • Planarity and alignment do not drift after extended use
  • Options of 1x2, 2x2, 2x3, 2x4, etc. for more efficient probe mapping
  • 60 micron pad pitch
  • Can be designed to use a generic PCB
  • Uniform beam length optimizes control of BCF






Minimum Pad Pitch: 50um in-line, 35/70um staggered

Minimum Bond Bad: <45um square

Electrical Specifications Measured on Probe Card Analyzer

  • Planarity and Alignment: +/-0.25 mils for flat pads
  • Contact Resistance Measured: <2 ohms at 25mA
  • Standard Leakage 10nA @ 5V

Probe Tip Depth: Probe depth is measured from probe tip to the bottom of the PCB 80-350 mils +/-5 mils. (This is dependent on temperature and probe layer count)

Balance Contact Force (BCF): 1.2 to 3.0 gm/mil of overdrive (Dependent on overall design of ring, pad pitch and pad size)

Tip Diameter: +/-.2 mils

Tip Length: +2/-1 mil

Edge Sensor: 2 wire, 2 wire isolated, 3 wire isolated

Edge Sensor Resistance: 1.0Ω max between the sensor probe and the switch

Probing Temperature: Ambient up to 85º C, High Temp 86°- 150ºC, Ultra-High Temp 151-200C

Probe Material:

  • Tungsten
  • Rhenium Tungsten (RhTungsten)
  • Hardened Beryllium Copper (HBeCu)
  • Beryllium Copper (BeCu)
  • Paliney7™
  • Newtek

Printed Circuit Boards Materials:

  • High Temp FR4 (Polyclad 370)
  • Gtek
  • Nelco High Performance (N4000-13)
  • Polyimide
  • Rogers
  • Mixed Dielectrics
  • Flatness 5.0 mils per linear inch

PCB Design and Fabrication

BCF measurements available upon request

Copyright © 2012 Rucker Kolls Inc. 
Rucker Kolls, the Rucker Kolls logo and Butterfly design are trademarks or registered trademarks of Rucker Kolls Inc.
All other trademarks are the property of their respective owners.      Designed by